surface mountable ptc resettable fuse page <1> 17/05/11 v1.1 http://www.farnell.com http://www.newark.com http://www.cpc.co.uk specifications: applications : all high-density boards. product features : small surface mountable, solid state, faster time to trip than standard smd devices, lower resistance than standard smd devices. maximum voltage : 6v to 15v. temperature range : -40c to 85c. electrical characteristics (23c) hold current trip current rated voltage maximum current typical power maximum time to trip resistance part number current time r min r1 max i h, a i t, a v max, v dc i max, a p d, w amperes seconds ? ? ? ? 0.20 0.50 9 100 0.5 8.00 0.02 0.400 3.500 mc36206 0.35 0.75 6 100 0.5 8.00 0.10 0.250 1.200 mc36210 0.50 1.00 6 100 0.5 8.00 0.10 0.150 0.850 mc36213 0.75 1.50 6 40 0.6 8.00 0.20 0.090 0.350 mc36215 1.00 1.95 6 40 0.6 8.00 0.30 0.060 0.210 MC36220 i h = hold current-maximum current at which the device will not trip at 23c still air. i t = trip current-minimum current at which the device will always trip at 23c still air. v max = maximum voltage device can withstand without damage at it rated current (i maximum). i max = maximum fault current device can withstand without damage at rated voltage (v maximum). p d = typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23c still air environment. r min = minimum device resistance at 23c prior to tripping. r1 max = maximum device resistance at 23c measured 1 hour after tripping or reflow soldering of 260c for 20 seconds. termination pad characteristics termination pad materials: pure tin. production dimensions (millimeter) ul : e-345437
surface mountable ptc resettable fuse page <2> 17/05/11 v1.1 http://www.farnell.com http://www.newark.com http://www.cpc.co.uk a b c d e figure part number minimum maximum minimum maximum minimum maximum minimum maximum minimum maximum 2.00 2.30 1.20 1.50 0.55 1.00 0.20 0.60 1 mc36206 2.00 2.30 1.20 1.50 0.45 0.75 0.20 0.60 1 mc36210 2.00 2.20 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45 2 mc36213 2.00 2.20 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45 2 mc36215 2.00 2.20 1.20 1.50 0.75 1.80 0.20 0.60 0.10 0.45 2 MC36220 dimensions table thermal derating curve thermal derating curve ambient temperature (c) percent of rated hold and trip current dimensions : millimetres typical time-to-trip at 23c b = mc36206 c = mc36210 d = mc36213 e = mc36215 f = MC36220 fault current (a) time-to-trip (s)
surface mountable ptc resettable fuse page <3> 17/05/11 v1.1 http://www.farnell.com http://www.newark.com http://www.cpc.co.uk material specification terminal pad material : pure tin. soldering characteristics : meets eia specification rs 186-9e, ansi/j-std-002 category 3. pad layouts solder reflow and rework recommendations the dimension in the table below provide the recommended pad layout for each 0805 device. device a nominal b nominal c nominal all 0805 series 1.20 1.00 1.50 profile feature pb-free assembly average ramp-up rate (t s maximum to t p ) 3c/second maximum preheat: temperature minimum (t s minimum) temperature maximum (t s maximum) time (t s minimum to t s maximum) 150c 200c 60-180 seconds time maintained above: temperature (t l ) time (t l ) 217c 60-150 seconds peak/classification temperature (t p ): 260c time within 5c of actual peak: temperature (t p ) 20-40 seconds ramp-down rate: 6c/second maximum time 25c to peak temperature: 8 minutes maximum solder reflow due to ?lead free? nature, temperature and dwelling time for the soldering zone is higher than those for regular. this may caus e damage to other components. 1. recommended max past thickness > 0.25mm. 2. devices can be cleaned using standard methods and aqueous solvent. 3. rework use standard industry practices. 4. storage environment : < 30c/60% rh. caution: 1. if reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. devices are not designed to be wave soldered to the bottom side of the board. note 1: all temperatures refer to of the package, measured on the package body surface. pad dimensions dimensions : millimetres
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